
77 GHz radar high-frequency board
- Layers
- 18
- Materials
- TSM-DS3 + FR28 prepreg + S1000-2M, hybrid lamination
- Finish
- Immersion gold (ENIG)
- Special process
- Pure PTFE blind/buried-via impedance board, 5 back-drill groups
Build prototypes and production orders with engineering review, controlled manufacturing data, PCB assembly and order-specific delivery support.
Source: ShinePCB capability workbook, 2025. Values are confirmed per order during engineering review.
Rigid, flexible and specialty boards reviewed by engineering before every quotation.
Advanced PCB technologies, assembly, mechanical parts and engineering services in one project.
Complex interconnects, controlled impedance and specialty laminates for RF, high-speed and high-density designs, confirmed through engineering review for each project.
Surface-mount, through-hole and mixed assembly with component sourcing, scoped from your BOM, placement data and assembly drawings.
Machined, fabricated and printed parts that complete your electronic products, available through the ShinePCB manufacturing network and confirmed per drawing.
Services around your boards and assemblies, from DFM and impedance engineering to sourcing, testing and final integration.
Stack-up, materials, drill data and special processes are checked and questions raised before you commit to production.
Each order is matched to the facility in the ShinePCB manufacturing network whose process and qualification fit the requirements.
Prototype and mass-production limits are quoted in separate columns, so the production build is planned on its own terms.
ISO 9001, IATF 16949, UL 796 and IECQ QC 080000 cover printed circuit board manufacturing.
Gerber, BOM and design files are managed under an ISO/IEC 27001 information security system.
The accepted quotation, production scope and delivery information stay connected to your project.
From double-sided boards to 48-layer prototypes, HDI, rigid-flex and hybrid RF stack-ups. Production runs on automated imaging, drilling, plating and inspection lines with AOI, X-ray, flying-probe and impedance testing.
Our Shenzhen team coordinates your project and releases it to the facility in the ShinePCB manufacturing network that fits the process, material and quality requirements.

SMT, through-hole and mixed assembly with component sourcing through authorized distributors or customer-designated sources. Standard SMT handles 0201 chips and 0.5 mm BGA pitch; 01005 and finer pitches are available as advanced process.
Boards, cables, enclosures and mechanical parts can be combined into box-build projects.

Held for printed circuit board manufacturing. Documents on request.
Quality details








Partner references retained from the previous website and grouped by relationship type.
Sytech
Panasonic
Rogers
Isola
Taconic
ITEQ
Kingboard
China Jushi
University of Electronic Science and Technology of China
Shenzhen Polytechnic University
Shandong University
Shenzhen University
Inner Mongolia University
University of Macau
Tsinghua University
MEMSensing
HGZN
Transcom
QuantumCTek
SCIYON
PANDA
CRSC
BOE
Bojay
ShinePCB focuses on high-frequency and high-speed PCB engineering, with material experience across Rogers, Isola, Taconic, PTFE and low-loss laminates. Material systems are reviewed against frequency, loss, stack-up and availability targets.
Before quotation, PCB DFM review covers data completeness, stack-up, impedance, drill and route data, copper and spacing, special processes and test requirements. Engineering questions are resolved before production release.
Board constructions from the ShinePCB company presentation.





Builds from the ShinePCB company presentation. They illustrate process scope and are not customer references.
Typical board requirements by application — reviewed per project, not customer references.

Automotive / radar

RF / communication

Industrial electronics

ISO 13485 via manufacturing network

Electronics

High-speed / high-layer

RF / microwave

Typical board requirements by application
A coordinated service package for demanding PCB and automotive-electronics projects, backed by partner factories in Dalian, Zhuhai, Shenzhen, Ningbo and Wuhan.
